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ay ch6 stack
Question | Answer |
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Advanced Configuration and Power Interface | current set of standards that is used by BIOS, hardware,and the OS,and manage power. |
back-side bus | the portion of the internal bus that connects the processors to the internal memory cache. |
case fan | draw air in and out of the case. |
Centrino | technology used by Intel whereby the processor, chipset,and wireless network adapter all interconnected. |
chassis air guide | a round air duct that helps to pull and direct fresh air into or out of the case. |
Cool’n’Quiet | a feature of AMD processors that lower power requirements and helps keep a system quiet. |
Cooler | A device for keeping components cool in a computer. |
DRAM | stands for dynamic random access memory, a type of memory used in most personal computers. |
dual-core processing | a CPU with two processors in the same integrated circuit. |
Enhanced Intel SpeedStep Technology | an Intel thermal and power management technology that allows the the processor performance and power consumption levels to be modified while a system is running. |
Execute disable bit | a technology used in CPUs to segregate areas of memory for use by either storage of processor instructions (or code) or for storage of data. |
front-side bus | the bus that carries data between the CPU and the northbridge.. |
heat sink | a piece of metal ,with cooling fins ,that can be attached to or mounted on an integrated chip to dissipate heat. |
hyper-threading | Intel's technology that allows each logical processor within the processor package to handle an individual thread in parallel with other threads being handle by other processor within the package. |
hyper transport | AMD's technology that allows each logical processor within the processor package to handle an individual thread in parallel with other threads being handle by other processor within the package. |
internal bus | the bus inside the cpu that is used for communication between the cpu's internal components. |
Level 1 (L1) cache | memory on the processor die. |
Level 2 (L2) cache | memory in the processor package but not on the die. |
Level 3 (L3) cache | farther from the processor but still in the processor package. |
liquid cooling system | a pump is used to pump water in tubes to components on the mother and removes the heat and moves it to were it can be cooled. |
memory cache | a small amount of fast RAM that stores recently retrieved data, in anticipation of what the CPU will request next,thus speeding up access. |
Multimedia Extensions | multimedia instructions built into Intel processors to add functionality such as better processing of multimedia,SIMD support,and increased cache. |
multi-core processing | a processor technology whereby the processor housing contains two or more processor cores that operate at the the same frequency,but independently of each other. |
multiplier | the factor by which the bus speed or frequency is multiplied to get the CPU clock speed. |
multiprocessor platform | a system that contains more then one processor. |
octo core | a processor package that contains eight cores and supports 16 instructions at once. |
overclocking | running a processor at higher frequency than is recommended by the the manufacturer. |
PowerNow! | an AMD technology that increase performance and lowers power requirements for processors. |
processor frequency | the frequency at which the CPU operates. usually expressed in GHz. |
quad core | a processor package that contains four cores and supports eight instructions at once. |
S1 state | the ACPI power saving mode where the hard drive and monitor are turned off and everything else runs normally. |
S2 state | the ACIP power saving mode where the hard drive ,monitor,and processor are turned off. |
S3 state | the ACIP power saving mode where everything is shut down except RAM and enough of the system to respond to a wake-up call such as pressing the keyboard. |
static RAM | RAM chips that retain information without the need for refreshing. |
stop errors | an error at the kernel level that is severe enough to cause the operating system to stop all processes. |
thermal compound | used between the CPU surface and the heartsick to eliminate air pockets and to transfer heat quicker. |
triple core | a processor package that contains three core processors ,thus supporting six instructions at once. |