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White CH 6
Chapter 6
Term | Definition |
---|---|
Level 1 cache (L1 cache) | Memory that is on the processor die. |
Level 2 cache (L2 cache) | Memory in the processor packet, but not on the processor die. |
Level 3 cache (L3 cache) | A third cache from the processor core, but in the processor package. |
Hyper-Threading | allow each logical processor within the processor package to handle an individual thread in parallel with other threads being handled by other processors within the package. |
HyperTransport | allow each logical processor within the processor package to handle an individual thread in parallel with other threads being handled by other processors within the package. |
Front Side Bus (FSB) | An external bus that is 64 bits wide, and connects to the front side of the processor that faces the outside world. |
Internal Bus | Is 32 bits wide, and is inside the processor housing, data, instructions, addresses, and control signals. |
Back Side Bus (BSB) | the portion of the internal bus that connects the processor to the internal memory cache |
Advanced Configuration and Power Interface (ACPI) | specification developed by Intel, Compaq, Phoenix, Microsoft, and toshiba to control the power on computers and other devices. |
case fan | a fan inside the computer use to draw out air of or into the case. |
Centrino | a technology used by Intel whereby the processor, chipset, and wireless network adapter are all interconnected which improves the laptops performance. |
chassis air guide (CAG) | a round air duct that helps to pull and direct fresh air from outside a computer to the cooler and processor. |
Cool’n’Quiet | a feature of AMD processors that lowers power requirements and helps keep a system quiet. |
Cooler | a combination cooling fan and heat sink mounted on top or side of a processor to keep it cool. |
DRAM | the most common type of system memory, it requires refreshing every few milliseconds. |
dual-core processing | a processing package that contains two core processors, thus supporting four structures at once. |
Enhanced Intel SpeedStep Technology (EIST) | a processor feature that used by intel that steps down processor frequency when the processor is idle to conserve power and lower heat. |
Execute disable bit | a processor security feature by Intel that prevents software from executing or reproducing itself if it appears to be malicious. |
heat sink | a piece of metal, with cooling fins, that can be attached to or mounted on an integrated chip (such as the CPU) to dissipate heat. |
liquid cooling system | a method to cool overclocked processors that use a small pump inside the computer case and tubes that move water or other liquid around components and then away from them to a place where fans can cool the liquid. |
memory cache | is RAM that hold data and instructions that the memory controller anticipates the processor will need next. |
MMX (Multimedia Extensions) | first technology to support repetitive looping, whereby the processor receives an instruction and then applies it to a stream of data that follows. |
multi-core processing | the processor that hosts two or more cores that operate at the same frequency, but independently. |
multiplier | the processor works at four |
multiprocessor | is designed to support more than one processor, by providing more than one socket. |
octo | supports 16 instructions |
overclocking | running a motherboard or processor at a higher speed than recommended. |
PowerNow! | increases performance and lowers power requirements. |
processor frequency | is the speed in which the processor operates internally. |
quad core | supports eight instructions |
S1 state | hard drive and monitor are turned off and everything else runs normally. |
S2 state | hard drive, monitor, and processor are turned off. |
S3 state | everything is shut down except RAM and enough of the system to respond and to wake up. |
static RAM (SRAM) | does not need refreshing and holds memory as long as power is available. |
stop errors | an error at the kernel level that is sever enough to cause the operating system to stop all processes. |
thermal compound | a cream like substance that is placed between the bottom of the cooler heatsink and the top of the processor to eliminate air pockets and to help drawthe heat off the processor |
triple core | supports six instructions at once. |