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RNCH7 STACK 2
chapter 7 stack 2
Term | Definition |
---|---|
parity error | a parity error causes the system to halt |
CAS Latency | column access strobe |
RAS Latency | row access strobe |
Direct Rambus RAM | named after Rambus, Inc., a rambus memory module is called a RIMM |
C-RIMM | continuity RIMM it ensures continuity throughout all slots |
FPM (fast page memory) | can be used with 30 pin or 72 pin SIMMS |
EDO (extended data out) | improves on FPM and is used in 72 pin SIMMs and 168 pin DIMMs |
Burst EDO (BEDO) | improved on EDO but is rarely used |
re-marked chips | chips that have been used, returned to the factory, marked again, and then resold |
DDR 2 | faster and uses less power than DDR |
DDR 3 | is faster and uses less power than DDR 2 |
General Protection Fault (GPF) | in Windows it is used to look at things that go wrong with memory and what to do about them |
DDR | another word for Double Data RAM |