ay ch6 stack
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each of the black spaces below before clicking
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| Advanced Configuration and Power Interface | current set of standards that is used by BIOS, hardware,and the OS,and manage power.
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| back-side bus | the portion of the internal bus that connects the processors to the internal memory cache.
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| case fan | draw air in and out of the case.
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| Centrino | technology used by Intel whereby the processor, chipset,and wireless network adapter all interconnected.
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| chassis air guide | a round air duct that helps to pull and direct fresh air into or out of the case.
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| Cool’n’Quiet | a feature of AMD processors that lower power requirements and helps keep a system quiet.
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| Cooler | A device for keeping components cool in a computer.
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| DRAM | stands for dynamic random access memory, a type of memory used in most personal computers.
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| dual-core processing | a CPU with two processors in the same integrated circuit.
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| Enhanced Intel SpeedStep Technology | an Intel thermal and power management technology that allows the the processor performance and power consumption levels to be modified while a system is running.
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| Execute disable bit | a technology used in CPUs to segregate areas of memory for use by either storage of processor instructions (or code) or for storage of data.
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| front-side bus | the bus that carries data between the CPU and the northbridge..
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| heat sink | a piece of metal ,with cooling fins ,that can be attached to or mounted on an integrated chip to dissipate heat.
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| hyper-threading | Intel's technology that allows each logical processor within the processor package to handle an individual thread in parallel with other threads being handle by other processor within the package.
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| hyper transport | AMD's technology that allows each logical processor within the processor package to handle an individual thread in parallel with other threads being handle by other processor within the package.
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| internal bus | the bus inside the cpu that is used for communication between the cpu's internal components.
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| Level 1 (L1) cache | memory on the processor die.
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| Level 2 (L2) cache | memory in the processor package but not on the die.
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| Level 3 (L3) cache | farther from the processor but still in the processor package.
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| liquid cooling system | a pump is used to pump water in tubes to components on the mother and removes the heat and moves it to were it can be cooled.
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| memory cache | a small amount of fast RAM that stores recently retrieved data, in anticipation of what the CPU will request next,thus speeding up access.
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| Multimedia Extensions | multimedia instructions built into Intel processors to add functionality such as better processing of multimedia,SIMD support,and increased cache.
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| multi-core processing | a processor technology whereby the processor housing contains two or more processor cores that operate at the the same frequency,but independently of each other.
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| multiplier | the factor by which the bus speed or frequency is multiplied to get the CPU clock speed.
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| multiprocessor platform | a system that contains more then one processor.
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| octo core | a processor package that contains eight cores and supports 16 instructions at once.
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| overclocking | running a processor at higher frequency than is recommended by the the manufacturer.
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| PowerNow! | an AMD technology that increase performance and lowers power requirements for processors.
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| processor frequency | the frequency at which the CPU operates. usually expressed in GHz.
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| quad core | a processor package that contains four cores and supports eight instructions at once.
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| S1 state | the ACPI power saving mode where the hard drive and monitor are turned off and everything else runs normally.
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| S2 state | the ACIP power saving mode where the hard drive ,monitor,and processor are turned off.
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| S3 state | the ACIP power saving mode where everything is shut down except RAM and enough of the system to respond to a wake-up call such as pressing the keyboard.
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| static RAM | RAM chips that retain information without the need for refreshing.
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| stop errors | an error at the kernel level that is severe enough to cause the operating system to stop all processes.
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| thermal compound | used between the CPU surface and the heartsick to eliminate air pockets and to transfer heat quicker.
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| triple core | a processor package that contains three core processors ,thus supporting six instructions at once.
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